Spectra7 and Foxconn demonstrate 400 Gbps PAM4 active copper cables

DesignCon QSFP-DD Active Copper Interconnection Showcase from 28 al 34AWG It includes higher speed, range and routability in hyper-scaled facilities

SAN JOSE, Calif., August 16, 2021 / PRNewswire / – (TSXV: SEV) (OTCQB: SPVND) Spectra7 Microsystems Inc. (“Spectra7“or the”Company“), a leading provider of high-performance analog semiconductor products for the broadband connectivity markets, and Foxconn Interconnect Technology, Inc. (Foxconn), a leading provider of interconnect solutions, announced that they will demonstrate several lengths and 400 Gbps AWG QSFP-DD Active Copper Cables (ACC) at DesignCon 2021 Enabled August 17th and 18 inches San Jose, California.

(PRNewsfoto / Spectra7 Microsystems Inc.)

400 Gbps interconnects are increasingly used to interconnect high-power Artificial Intelligence (AI) and Machine Learning (ML) servers that need this massive bandwidth to analyze ever-larger data sets. complex, as well as to serve the growing focus on parallel computing in this data. centers. At lower speeds of 25 Gbps, 40 Gbps, and 100 Gbps, these servers have been connected with passive direct-connect (DAC) copper cables. Now, at 400 Gbps, hypercalators require thinner, more flexible cables to accommodate the increased frame density. Bringing a 400 Gbps passive DAC to each server is a challenge, as these cables are usually 26AWG and extremely difficult to traverse. Folding radius and folding space are key parameters of the cable. Spectra7 GaugeChangerTM the tabs allow smaller measurements up to 34AWG copper will be used dramatically improving both measurements. Foxconn will demonstrate a 2.5 meters 34AWG ACC to address this application.

Hypercalators also require longer cables to accommodate an increase in switching radius. At 400 Gbps, passive DACs can only reach 2.5 meters. Foxconn will demonstrate a 5 meters 28AWG ACC to address these longer-range applications.

“Foxconn is a leader in technology and the marketplace,” said the CEO of Spectra7 Raouf Halim. “We are proud to collaborate with them in the growing active copper cable market and are excited to showcase our technology with them at the DesignCon 2021 exhibition.”

ABOUT FOXCONN INTERCONNECT TECHNOLOGY, LIMITED (“FIT”)

Foxconn Interconnect Technology (TO ADJUST) is a world-leading developer and manufacturer of solutions that cultivates connectivity for a better world. With unmatched capabilities in development, research, engineering and manufacturing design, production, supply chain and business planning for world-class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of global technology trends. which offer compelling importance. scale user experiences. With offices and manufacturing centers located in Asia, America and Europe, FIT is a world leader in the manufacture of high precision interconnect components.

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high-performance analog semiconductor company that offers unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading virtual reality, augmented reality, mixed reality, data center and other electronics manufacturers. of connectivity. Spectra7 is based on San Jose, California with a design center in Barcelona Cork, Ireland and location of technical support a Dongguan, China. For more information, visit www.spectra7.com.

Neither TSX Venture Exchange nor its regulatory services provided (as defined in the TSX Venture Exchange policies) assume responsibility for the adequacy or accuracy of this release.

CAUTION NOTES

Some statements contained in this press release constitute “forward-looking statements.” All statements other than statements of historical facts contained in this press release, including, without limitation, the timing of the effective date of consolidation, strategy, plans, objectives, goals and objectives of the Company and any statement preceded by, followed by or including the words “believe”, “expect”, “objective”, “intend”, “plan”, “continue”, “do”, “can”, “would”, ” anticipate “,” estimate “,” predict “”, “predict”, “project”, “seek”, “should” or similar expressions or their negative, are forward-looking statements. These statements are not historical facts, but represent only the Company’s expectations, estimates and projections of future events.These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict.Therefore, actual results may differ materially from what is expressed, implied or implied. is provided in these d prospective clarifications. Additional factors that may cause significant differences in actual results, performance or achievement include, but are not limited to, risk factors discussed in the discussion and analysis of the company’s management for the year. finished. December 31, 2020. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and warns investors not to rely on forward-looking information. Accordingly, all forward-looking statements made in this press release are qualified by such precautionary statements and other statements or precautionary factors it contains, and there is no guarantee that the actual results or developments will be made or even if they are made. substantially, which will have the expected consequences or effects on the company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except the required by law.

For more information, contact:

Spectra7 Microsystems Inc.
John Mitchell
Investor relations
650-269-3043
[email protected]

Spectra7 Microsystems Inc.
Bonnie Tomei
Finance chief
669-212-1089
[email protected]

Cision

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